Micro-Electrical-Mechanical-Systems (MEMS) and Nanotechnology Facilities

Flip Chip Bonder and Cryogenic Life Test Dewar

The MEMS and Nanotechnology facilities provide design, analysis, fabrication, micro-assembly, and test laboratory support for an array of MEMS and nanotech components and systems. Design capabilities are comprised of various sub-micron layout and analysis software packages, while device fabrication is done utilizing the DDL processing facility.  A number of specialized cleanroom laboratories within the branch provide micro-assembly, testing, and packaging capabilities. 

 


Contact Person: Mary Li 301 286-9921