Fabrication Capabilities
- Class 10, 4800 square foot, semiconductor fabrication lab
- Ion implantation
- Lithography: optical and electron beam with resolution <= 1 um
- Ultrahigh vacuum deposition systems
- Deep reactive ion etching
- Physical vapor deposition systems
- Low pressure chemical vapor deposition
- Plasma enhanced chemical vapor deposition
- Wet chemistry benches for acids, bases, and solvents
- Indium bump bonding
- Wafer bonding
- Wafer dicing: mechanical and laser
- XeF2 etching
- Thin film metrology: film thickness, film stress
- Superconducting material fabrication
