

Fluorine- and chlorine-based tools with dedicated chambers for dry metal etching.
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Contact aligners with front-to-back alignment capabilities. Two µm minimum lines/spaces. Thick and thin resists. E-beam direct-write lithography.
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Evaporation and sputter of many materials. Dedicated chambers for magnetic material and indium deposition.
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High-energy implant up to 1 MeV and 1 mA. PECVD nitride and LPCVD nitride, oxide, and polysilicon.
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Wet and dry release processes for MEMS. Diamond and laser dicing for singulation. Wafer lapping, wire bonding, pick and place, flip chip bonding, and wafer bonding. › Find out more

Thin film thickness measurements, profilometry, scanning electron microscopy, and probe station.
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