Fabrication Capabilities

Fabrication images

  • Class 10, 4800 square foot, semiconductor fabrication lab
  • Ion implantation
  • Lithography: optical and electron beam with resolution  <= 1 um
  • Ultrahigh vacuum deposition systems
  • Deep reactive ion etching
  • Physical vapor deposition systems
  • Low pressure chemical vapor deposition
  • Plasma enhanced chemical vapor deposition
  • Wet chemistry benches for acids, bases, and solvents
  • Indium bump bonding
  • Wafer bonding
  • Wafer dicing:  mechanical and laser
  • XeF2 etching
  • Thin film metrology:  film thickness, film stress
  • Superconducting material fabrication